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Dymax Introduces Needle Bonding Adhesive

UV+EB Technology

SUBMITTED

Dymax, Torrington, Connecticut, introduced 1406-M, a next-generation needle bonding adhesive for manufacturers looking to switch to LED curing in small gauge needle applications.

It provides superior bonding performance on the reduced surface area of smaller cannulas, even after aging and sterilization, to reduce the possibility of cannula substrate failure. Optimized for 385nm LED curing, 1406-M allows for tighter standard deviations and enables small gauge needle manufacturers to enjoy the benefits of LED curing without sacrificing speed or cured mechanical properties.

For more information, visit www.dymax.com.